Laser Cutting Machine

Equipped with UV laser and high precision laser processing system, the machine is applicable to FPC, cover layer, IC substrate appearance molding and precision cutting.

Product Details

Applicable to a variety of materials for processing

The machine is suitable for a variety of different materials processing such as FPC, cover layer, precision molding and cutting of IC substrate.

Save the molding cost

For diverse small amounts of product processing, it can save the cost of molding in traditional processing and rapidly get back equipment investment cost and shorten sample delivery time.

Reliable quality

Non-contact processing technology effectively prevents deformation and stress caused in mechanical cutting production.

Flexible customized design specification

For different customer needs, we provide customized designs such as the rule type, load size, different processing characteristics modification, production capacity requirements, etc.